Latent liquid imidazole-type epoxy electronic underfill adhesive curing agent

Latent Liquid Imidazole-Type Epoxy Electronic Adhesive Underfill Curing Agent

Product Description

LH-01 is a modified imidazole-type epoxy curing agent with a core-shell structure, presenting as a viscous paste-like liquid at room temperature. It offers excellent stability, good dispersibility, and rapid low-temperature curing properties. The cured product exhibits performance typical of imidazole-cured materials, with a matte to semi-matte surface that is uniform and smooth. It can be applied in electronic adhesives, underfill adhesives, printed circuit board laminates, coatings, composite materials, and more.

Technical Specifications

Latent Liquid Imidazole-Type Epoxy Electronic Adhesive Underfill Curing Agent

Reference Formulation

Adhesive storage stability: 40℃   One month

60℃   72 hours

Usage Instructions

As an epoxy curing agent, the usage amount is 40%-100% of the liquid epoxy resin (128). As an accelerator for dicyandiamide, hydrazides, etc., the usage amount is 1%-20% of the liquid epoxy resin (128). The dosage can be adjusted according to curing conditions. Avoid using a three-roll mill during application; simply mix thoroughly after adding to the system. Reactive diluents, water, and solvents may affect or compromise the adhesive's storage stability. If necessary, conduct tests to determine the extent of impact.

Packaging and Storage

5KG/drum. Store in a cool, dry place.

Shelf life at room temperature: 6-12 months; at 5℃: 2 years.

Latent Liquid Imidazole-Type Epoxy Electronic Adhesive Underfill Curing Agent